Mushure mekugadzira iyoPCB bhodhi, tinoda kusarudza nzira yekurapa kwepamusoro yebhodhi redunhu.Iyo inowanzo shandiswa pamusoro pemagadzirirwo epamusoro ebhodhi redunhu ndeye HASL (pamusoro tin spraying process), ENIG (immersion gold process), OSP (anti-oxidation process), uye inowanzoshandiswa pamusoro Tingasarudza sei nzira yekurapa?Yakasiyana PCB pamusoro pekurapa maitiro ane machaji akasiyana, uye ekupedzisira mhedzisiro zvakare akasiyana.Iwe unogona kusarudza maererano nemamiriro chaiwo.Rega ndikuudze nezvezvakanakira uye zvakaipira nzira nhatu dzakasiyana dzekurapa pamusoro: HASL, ENIG, uye OSP.
1. HASL (Surface tin spraying process)
Kupfapfaidza kwerata kunopatsanurwa kuita mutobvu wekupfapfaidza tin uye mutobvu usina mutobvu wekupfapfaidza.Iyo tin spray process ndiyo yakanyanya kukosha pamusoro pekurapa maitiro muma1980s.Asi ikozvino, mashoma uye mashoma ematunhu mabhodhi anosarudza tin spray process.Chikonzero ndechekuti bhodhi redunhu mune "diki asi rakanakisa" gwara.HASL maitiro anozotungamira kune hurombo solder mabhora, bhora point tini chikamu chinokonzereswa kana yakanaka weldingIyo PCB Assembly masevhisichirimwa kuitira kutsvaga yakakwirira mwero uye tekinoroji yemhando yekugadzira, ENIG uye SOP maitiro ekurapa epamusoro anowanzo kusarudzwa.
Zvakanakira zve lead-spray tin : mutengo wakaderera, yakanakisa welding performance, zvirinani mechanical simba uye gloss pane lead-sprayed tin.
Zvakaipa zvemutobvu-sprayed tin: Lead-sprayed tin ine lead heavy metals, iyo isingaenderane nemamiriro ekunze mukugadzirwa uye haigone kupasa kuongororwa kwekuchengetedzwa kwezvakatipoteredza seROHS.
Zvakanakira zvekupfapfaidza tin pasina lead: mutengo wakaderera, kuita kwakanakisa welding, uye zvine hushamwari zvakatipoteredza, inogona kupasa ROHS uye kumwe kuongorora kwekuchengetedza kwezvakatipoteredza.
Zvakaipa zvemutobvu-isina tin spray: Mechanical simba uye gloss hazvina kunaka senge lead-isina tin spray.
Izvo zvinowanzoitika zvakashata zveHASL: Nemhaka yekuti kutsetseka kwepamusoro kwetini-sprayed board haina kunaka, haikodzeri mapini ekutengesa ane mapeji akanaka uye zvikamu zviduku zvakanyanya.Matani mabhedhi anogadzirwa zviri nyore muPCBA kugadzirisa, izvo zvinowanzokonzera mapfupi maseketi kune zvikamu zvine mapeji akanaka.
2. ENIG(Goridhe-kunyura maitiro)
Goridhe-kunyura maitiro idanho repamberi rekurapa, iro rinonyanya kushandiswa pamabhodhi edunhu ane mashandiro ekubatanidza zvinodiwa uye nguva refu yekuchengetedza pamusoro.
Zvakanakira zve ENIG: Haisi nyore kuita oxidize, inogona kuchengetwa kwenguva yakareba, uye ine nzvimbo yakati sandara.Inokodzera solder yakanaka-gap mapini uye zvikamu zvine madiki solder majoini.Reflow inogona kudzokororwa kakawanda pasina kuderedza solderability yayo.Inogona kushandiswa se substrate yeCOB wire bonding.
Zvakaipa zve ENIG: Mutengo wepamusoro, urombo husina simba hwekushongedza.Nekuti iyo electroless nickel plating process inoshandiswa, zviri nyore kuve nedambudziko reblack disk.Iyo nickel layer inogadzirisa nekufamba kwenguva, uye kuvimbika kwenguva refu inyaya.
3. OSP (anti-oxidation process)
OSP ifirimu rinoumbwa nemakemikari pamusoro pemhangura isina chinhu.Iyi firimu ine anti-oxidation, kupisa uye hunyoro kuramba, uye inoshandiswa kuchengetedza mhangura kubva kune ngura (oxidation kana vulcanization, nezvimwewo) munzvimbo yakajairika, iyo yakaenzana neanorwisa-oxidation kurapwa.Nekudaro, mune inotevera tembiricha yekushisa solder, iyo inodzivirira firimu inofanira kubviswa nyore nyore nekuyerera, uye yakafumurwa yakachena mhangura pamusoro inogona kusanganiswa nekukurumidza neyakanyungudutswa solder kuti iite yakasimba solder joint munguva pfupi.Parizvino, chikamu chemapuranga edunhu anoshandisa OSP pamusoro pekurapa maitiro akawedzera zvakanyanya, nekuti iyi nzira yakakodzera kune yakaderera-tech dhiketi mabhodhi uye yepamusoro-tech dunhu mabhodhi.Kana pasina chepamusoro chekubatanidza chinoshanda chinodiwa kana kuchengetedza nguva yekumisikidza, maitiro eOSP ndiwo achave akanyanya kunaka epamusoro kurapwa maitiro.
Zvakanakira zveOSP:Iyo ine zvese zvakanakira zvekushama mhangura welding.Bhodhi rakapera (mwedzi mitatu) rinogona kudzorerwa zvakare, asi rinowanzogumira kune imwe nguva.
Zvakaipa zveOSP:OSP inobatwa neacid uye humidity.Kana ichishandiswa kune yechipiri reflow soldering, inoda kupedzwa mukati meimwe nguva yenguva.Kazhinji, mhedzisiro yechipiri reflow soldering ichave yakashata.Kana nguva yekuchengetedza ichipfuura mwedzi mitatu, inofanira kudzorerwa zvakare.Shandisa mukati maawa makumi maviri nemana mushure mekuvhura package.OSP insulating layer, saka test point inofanirwa kudhindwa ne solder paste kuti ibvise iyo yepakutanga OSP layer kuti ibate pini yekuyedza magetsi.Kuita kwegungano kunoda shanduko huru, kuongorora nzvimbo dzakasvibirira dzemhangura kunokuvadza kuICT, yakanyanyisa-tipped ICT probes inogona kukuvadza PCB, inoda chenjedzo yemaoko, kudzikamisa ICT kuyedzwa uye kuderedza kudzokorora bvunzo.
Izvo zviri pamusoro apa kuongororwa kwemaitiro ekurapa kwepamusoro kweHASL, ENIG uye OSP mabhodhi edunhu.Iwe unogona kusarudza nzira yekurapa pamusoro pekushandisa maererano nekushandiswa chaiko kwebhodhi redunhu.
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Nguva yekutumira: Jan-31-2022