Yakadhindwa Circuit Board ndiyo ibwe rekona rezvigadzirwa zvemagetsi, zvakakosha kuti zvigadzirwa zvako zvifambe zvakadzikama kwenguva yakareba kana kwete.Senyanzvi PCB uye PCB Assembly kugadzira, PCBFuture inoisa kukosha kwepamusoro pamhando yemabhodhi edunhu.
PCBFuture tanga kubva kuPCB Fabrication bhizinesi, wozowedzera kuPCB gungano uye zvikamu zvekutsvagisa masevhisi, ikozvino yave imwe yeakanakisa turnkey PCB gungano mugadziri.Isu tinoita zvakawanda kuedza kuisa mari pamidziyo yepamberi yehunyanzvi hwekuita tekinoroji, yakagadziridzwa yemukati sisitimu yekushanda zviri nani, kupa simba vashandi kune hunyanzvi huri nani.
| Process | Item | Process Kugona | |
| Base Information | Kukwanisa Kugadzira | Layer count | 1-30 zvikamu |
| Bow and twist | 0.75% yakajairika, 0.5% yepamusoro | ||
| Min.yapera PCB saizi | 10 x 10mm(0.4 x 0.4") | ||
| Max.yapera PCB saizi | 530 x 1000mm(20.9 x 47.24 ") | ||
| Multi-press yebofu/yakavigwa vias | Multi-press Cycle≤3 nguva | ||
| Yakapedzwa bhodhi ukobvu | 0.3 ~ 7.0mm(8 ~ 276mil) | ||
| Yakapedzwa bhodhi ukobvu kushivirira | +/- 10% chiyero, +/- 0.1mm yepamusoro | ||
| Surface finish | HASL, Tungamira yemahara HASL, Flash goridhe, ENIG, Hard goridhe plating, OSP, Kunyudza Tin, Kunyudza sirivha, nezvimwe. | ||
| Selective surface finish | ENIG+Chigunwe chegoridhe, Flash yegoridhe+Chigunwe cheGoridhe | ||
| Material Type | FR4, Aluminium, CEM, Rogers, PTFE, Nelco, Polyimide/Polyester, nezvimwewo. | Uyewo unogona kutenga zvinhu sezvo chikumbiro | |
| Copper foil | 1/3oz ~ 10oz | ||
| Prepreg Type | FR4 Prepreg, LD-1080(HDI) | 106, 1080, 2116, 7628, nezvimwewo. | |
| Rakavimbika Muedzo | Peel simba | 7.8N/cm | |
| Fammability | 94V-0 | ||
| Ionic kusvibiswa | ≤1ug/cm² | ||
| Min.dielectric ukobvu | 0.075mm(3mil) | ||
| Impedance kushivirira | +/- 10%, min inogona kudzora +/- 7% | ||
| Yemukati layer&Outer layer Image Transfer | Machine Kugona | Muchina wekukwesha | Material ukobvu: 0.11 ~ 3.2mm(4.33mil ~ 126mil) |
| Saizi yechinhu: min.228 x 228mm(9 x 9") | |||
| Laminator, Exposer | Material ukobvu: 0.11 ~ 6.0mm(4.33 ~ 236mil) | ||
| Saizi yechinhu: min 203 x 203mm(8 x 8"), hukuru 609.6 x 1200mm(24 x 30 ") | |||
| Etching Line | Material ukobvu: 0.11 ~ 6.0mm(4.33mil ~ 236mil) | ||
| Saizi yechinhu: min.177 x 177mm(7 x 7") | |||
| Inner layer Process Kugona | Min.mutsara wemukati upamhi / nzvimbo | 0.075/0.075mm(3/3mil) | |
| Min.spacing kubva pagomba kumucheto kusvika conductive | 0.2mm(8mil) | ||
| Min.yemukati layer annular mhete | 0.1mm(4mil) | ||
| Min.yemukati layer yekuzviparadzanisa nevamwe clearance | 0.25mm (10mil) chiyero, 0.2mm (8mil) yepamusoro | ||
| Min.spacing kubva pabhodhi kumucheto kusvika conductive | 0.2mm(8mil) | ||
| Min.gap upamhi pakati pevhu rendarira | 0.127mm(5mil) | ||
| Unbalance mhangura ukobvu hwemukati core | H/1oz, 1/2oz | ||
| Max.kupera mhangura ukobvu | 10oz | ||
| Outer layer Process Kugona | Min.mutsara wekunze upamhi / nzvimbo | 0.075/0.075mm(3/3mil) | |
| Min.gomba pad size | 0.3mm(12mil) | ||
| Process Kugona | Max.slot tenting size | 5 x 3mm(196.8 x 118mil) | |
| Max.tende gomba saizi | 4.5mm(177.2mil) | ||
| Min.tending land width | 0.2mm(8mil) | ||
| Min.annular ring | 0.1mm(4mil) | ||
| Min.BGA chikamu | 0.5mm(20mil) | ||
| AOI | Machine Kugona | Orbotech SK-75 AOI | Ukobvu hwezvinhu: 0.05 ~ 6.0mm(2 ~ 236.2mil) |
| Saizi yechinhu: max.597 ~ 597mm(23.5 x 23.5") | |||
| Orbotech Ves Machine | Ukobvu hwezvinhu: 0.05 ~ 6.0mm(2 ~ 236.2mil) | ||
| Saizi yechinhu: max.597 ~ 597mm(23.5 x 23.5") | |||
| Kuchera | Machine Kugona | MT-CNC2600 Drill muchina | Material ukobvu: 0.11 ~ 6.0mm(4.33 ~ 236mil) |
| Saizi yechinhu: max.470 ~ 660mm(18.5 x 26") | |||
| Min.dhill size: 0.2mm(8mil) | |||
| Process Kugona | Min.multi-hit drill bit size | 0.55mm(21.6mil) | |
| Max.Aspect ratio (yakapedza bhodhi saizi VS Drill saizi) | 12:01 | ||
| Gomba kushivirira kwenzvimbo (kuenzaniswa neCAD) | +/-3mil | ||
| Counterbore hole | PTH&NPTH, Yepamusoro angle 130°, Yepamusoro dhayamita <6.3mm | ||
| Min.spacing kubva pagomba kumucheto kusvika conductive | 0.2mm(8mil) | ||
| Max.drill bit size | 6.5mm(256mil) | ||
| Min.multi-hit slot size | 0.45mm(17.7mil) | ||
| Hole size tolerance ye press fit | +/-0.05mm(+/-2mil) | ||
| Min.PTH slot saizi kushivirira | +/-0.15mm(+/-6mil) | ||
| Min.NPTH slot saizi kushivirira | +/-2mm(+/-78.7mil) | ||
| Min.spacing kubva pagomba kumucheto kuenda kune conductive (Blind vias) | 0.23mm(9mil) | ||
| Min.Laser drill size | 0.1mm(+/-4mil) | ||
| Countersink hole angle & Diameter | Pamusoro 82,90,120° | ||
| Wet Process | Machine Kugona | Panel & Pattern plating line | Material ukobvu: 0.2 ~ 7.0mm(8 ~276mil) |
| Saizi yechinhu: max.610 x 762mm(24 x 30") | |||
| Deburring Maching | Material ukobvu: 0.2 ~ 7.0mm(8 ~276mil) | ||
| Saizi yechinhu: min.203 x 203mm(8" x 8") | |||
| Desmear Line | Material ukobvu: 0.2mm ~ 7.0mm(8 ~276mil) | ||
| Saizi yechinhu: max.610 x 762mm(24 x 30") | |||
| Tin plating line | Ukobvu hwezvinhu: 0.2 ~ 3.2mm(8 ~126mil) | ||
| Saizi yechinhu: max.610 x 762mm(24 x 30") | |||
| Process Kugona | Gomba rusvingo rwemhangura ukobvu | avhareji 25um(1mil) chiyero | |
| Yakapera mhangura ukobvu | ≥18um(0.7mil) | ||
| Min mutsara wakafara we etching marking | 0.2mm(8mil)) | ||
| Max.akapedza huremu hwemhangura hwemukati&kunze kwezvikamu | 7oz | ||
| Yakasiyana mhangura ukobvu | H/1oz,1/2oz | ||
| Solder Mask & Silkscreen | Machine Kugona | Muchina wekukwesha | Material ukobvu: 0.5 ~ 7.0mm(20 ~ 276mil) |
| Saizi yechinhu: min.228 x 228mm(9 x 9") | |||
| Exposer | Ukobvu hwezvinhu: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Saizi yechinhu: max.635 x 813mm(25 x 32") | |||
| Gadzira muchina | Ukobvu hwezvinhu: 0.11 ~ 7.0mm(4.3 ~ 276mil) | ||
| Saizi yechinhu: min.101 x 127mm(4 x 5") | |||
| Color | Solder mask ruvara | Green, matte green, yellow, black, blue, red, white | |
| Silkscreen ruvara | White, yellow, black, blue | ||
| Solder Mask Kugona | Min.solder mask kuvhura | 0.05mm(2mil) | |
| Max.yavharwa nesaizi | 0.65mm(25.6mil) | ||
| Min.hupamhi hwekuvharwa kwemutsara neS/M | 0.05mm(2mil) | ||
| Min.solder mask legends upamhi | 0.2mm(8mil) chiyero, 0.17mm (7mil) yepamusoro | ||
| Min.solder mask ukobvu | 10um(0.4mil) | ||
| Solder mask ukobvu kune kuburikidza netende | 10um(0.4mil) | ||
| Min.kabhoni mafuta mutsara upamhi / nzvimbo | 0.25/0.35mm(10/14mil) | ||
| Min.tracer of carbon | 0.06mm(2.5mil) | ||
| Min.kabhoni mafuta mutsetse trace | 0.3mm(12mil)) | ||
| Min.spacing kubva pacarbon pattern kusvika pads | 0.25mm(10mil) | ||
| Min.hupamhi hweino peelable mask yekuvhara mutsara / pad | 0.15mm(6mil) | ||
| Min.solder mask bhiriji upamhi | 0.1mm(4mil)) | ||
| Solder mask Kuoma | 6H | ||
| Peelable Mask Kugona | Min.spacing kubva peelable mask pattern kusvika pad | 0.3mm(12mil)) | |
| Max.saizi yegomba retende rinosvuura mask (Nekudhinda skrini) | 2mm(7.8mil) | ||
| Max.saizi yegomba retende rinosvuura mask (Nealuminium kudhinda) | 4.5mm | ||
| Peelable mask ukobvu | 0.2 ~ 0.5mm(8 ~20mil) | ||
| Silkscreen Kugona | Min.silkscreen line width | 0.11mm(4.5mil) | |
| Min.silkscreen line urefu | 0.58mm(23mil) | ||
| Min.spacing kubva kungano kuenda padhi | 0.17mm(7mil) | ||
| Surface Finish | Surface Pedzisa Kugona | Max.kureba kwemunwe wegoridhe | 50mm(2") |
| ENIG | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.025 ~ 0.1um(0.001 ~ 0.004mil) goridhe | ||
| munwe wegoridhe | 3 ~ 5um(0.11 ~ 197mil) nickel, 0.25 ~ 1.5um(0.01 ~ 0.059mil) goridhe | ||
| HASL | 0.4um(0.016mil) Sn/Pb | ||
| HASL Machine | Material ukobvu: 0.6 ~ 4.0mm(23.6 ~ 157mil) | ||
| Material size: 127 x 127mm ~ 508 x 635mm(5 x 5" ~ 20 x 25") | |||
| Hard gold plateing | 1-5u" | ||
| Kunyudza Tin | 0.8 ~ 1.5um(0.03 ~ 0.059mil) Tin | ||
| Kunyudza Sirivha | 0.1 ~ 0.3um(0.004 ~ 0.012mil) Ag | ||
| OSP | 0.2 ~ 0.5um(0.008 ~ 0.02mil) | ||
| E-Test | Machine Kugona | Flying probe tester | Material ukobvu: 0.4 ~ 6.0mm(15.7 ~ 236mil) |
| Saizi yechinhu: max.498 x 597mm(19.6 ~ 23.5") | |||
| Min.spacing kubva pabvunzo pad kuenda kubhodhi kumucheto | 0.5mm(20mil) | ||
| Min.conductive resistance | 5Ω | ||
| Max.insulation resistance | 250mΩ | ||
| Max.test voltage | 500V | ||
| Min.test pad size | 0.15mm(6mil)) | ||
| Min.test pad to pad spacing | 0.25mm(10mil) | ||
| Max.test current | 200mA | ||
| Profileing | Machine Kugona | Profileing type | NC nzira, V-kucheka, slot tabs, gomba rechitambi |
| NC routing muchina | Material ukobvu: 0.05 ~ 7.0mm(2 ~ 276mil) | ||
| Saizi yechinhu: max.546 x 648mm(21.5 x 25.5") | |||
| V-kucheka muchina | Material ukobvu: 0.6 ~ 3.0mm(23.6 ~ 118mil) | ||
| Max zvinhu hupamhi hweV-cheka: 457mm(18") | |||
| Process Kugona | Min.routing bit size | 0.6mm(23.6mil) | |
| Min.tsanangura kushivirira | +/-0.1mm(+/-4mil) | ||
| V-cut angle type | 20°, 30°, 45°, 60° | ||
| V-cut angle kushivirira | +/-5° | ||
| V-kucheka kunyoresa kushivirira | +/-0.1mm(+/-4mil) | ||
| Min.minwe yegoridhe spacing | +/-0.15mm(+/-6mil) | ||
| Bevelling angle kushivirira | +/-5° | ||
| Bevelling inoramba yakakora kushivirira | +/-0.127mm(+/-5mil) | ||
| Min.radius yemukati | 0.4mm(15.7mil) | ||
| Min.spacing kubva conductive kuenda kurondedzero | 0.2mm(8mil) | ||
| Countersink/Counterbore deep tolerance | +/-0.1mm(+/-4mil) | ||