1, Kupisa mhepo solder kuenzana
Sirivha board inonzi tin hot air solder leveling board.Kupfapfaidza dhizaini rerata pachikamu chekunze chedunhu remhangura kunoitisa welding.Asi haigone kupa kuvimbika kwekusangana kwenguva refu segoridhe.Kana ukashandisa yakarebesa, zviri nyore kuita oxidize uye ngura, zvichikonzera kusabatana kwakashata.
Zvakanakira:Mutengo wakaderera, wakanaka welding performance.
Zvakaipa:The pamusoro flatness yemhepo inopisa solder leveling board haina kunaka, iyo isingakodzeri mapini ewelding ane gap diki uye zvikamu zvidiki zvakanyanya.Matani mabedhi ari nyore kugadzira mukatiPCB kugadzirisa, izvo zviri nyore kukonzeresa kupfupika kudiki kune madiki gap pini zvikamu.Kana ichishandiswa mumativi maviri-mativi eSMT maitiro, zviri nyore kupfapfaidza tin kunyunguduka, zvichikonzera marata erata kana spherical tin dots, zvichikonzera kusaenzana kwepamusoro uye kukanganisa matambudziko ekushongedza.
2、Sirivha yekunyudza
Iyo yekunyudza sirivheri maitiro iri nyore uye nekukurumidza.Sirivha inonyudzwa ndeyekuchinja-chinja, inova inenge submicron yakachena sirivha coating (5 ~ 15 μ In, inenge 0.1 ~ 0.4 μ m) Dzimwe nguva nzira yekunyudzwa kwesirivha inewo zvimwe zvinhu zvehupenyu, kunyanya kudzivirira sirivha uye kubvisa dambudziko. yeSilver migration.Kunyangwe ikaiswa mukupisa, mwando uye kusvibiswa, inogona kuramba ichipa zvinhu zvakanaka zvemagetsi uye kuchengetedza weldability yakanaka, asi inorasikirwa nekupenya.
Zvakanakira:Sirivha yakamisikidzwa welding yepasi ine yakanaka weldability uye coplanarity.Panguva imwecheteyo, haina zvipingamupinyi zvinoitisa seOSP, asi simba rayo harina kunaka segoridhe kana richishandiswa senzvimbo yekusangana.
Zvakaipa:Kana yakafumurwa kune yakanyorova nharaunda, sirivheri inoburitsa maerekitironi kutama pasi pechiito chevoltage.Kuwedzera organic components kune sirivheri kunogona kuderedza dambudziko rekutama kwemaerekitironi.
3、Tini yekunyudza
Immersion tin zvinoreva solder wicking.Kare, PCB yaiwanzoita ndebvu dzemarata mushure mekuita kweImmersion tin process.Ndebvu dzemarata uye kutama kwerata panguva yewelding zvinoderedza kuvimbika.Mushure meizvozvo, organic additives inowedzerwa kune tin immersion solution, kuitira kuti iyo tin layer dhizaini ive granular, iyo inokunda matambudziko apfuura, uye zvakare ine yakanaka yekudziya kugadzikana uye weldability.
Zvakaipa:Hutera hukuru hwekunyudzwa kwerata hupenyu hwayo hupfupi hwesevhisi.Kunyanya kana yakachengetwa munzvimbo yekupisa uye yakakwira humidity nharaunda, makomisheni pakati peCu / Sn masimbi acharamba achikura kusvika arasa solderability.Naizvozvo, marata akaiswa mukati haagone kuchengetwa kwenguva yakareba.
Isu tine chivimbo mukukupa iwe yakanakisa musanganiswa weturnkey PCB musangano sevhisi, mhando, mutengo uye nguva yekuendesa mune yako Diki batch vhoriyamu PCB gungano odha uye Mid batch Vhoriyamu PCB gungano kurongeka.
Kana iwe uchitsvaga yakakodzera PCB gungano mugadziri, ndapota tumira ako BOM mafaera uye PCB mafaera kunesales@pcbfuture.com.Ese mafaera ako akavanzika zvakanyanya.Tichakutumira quote chaiyo ine nguva yekutungamira mumaawa makumi mana nemasere.
Nguva yekutumira: Nov-21-2022